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Datacon 2200 evo plus die bonder 购买在 新加坡 (首都)
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购买 Datacon 2200 evo plus die bonder
Datacon 2200 evo plus die bonder

Datacon 2200 evo plus die bonder

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新加坡, 新加坡 (首都)
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The 2200 evo plus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership. It offers unbeaten flexibility and full customization possibilities. Higher accuracy is gained through a new camera system and enhanced thermal compensation algorithms.

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Datacon 2200 evo plus die bonder
Datacon 2200 evo plus die bonder
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